CHO-BOND 1030 ONE COMPONENT FLEXIBLE ELECTRICALLY CONDUCTIVE SILICONE ADHESIVE

Артикул

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Бренд

Parker

Цена

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Описание

Краткое описание: Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates
Опции полимерных материалов: Silicone
Материал наполнителя: Silver-plated copper
Коэффициент: 1-part
Цвет: Light Gray
Объемное сопротивление: 0.05 Ω-cm
Прочность соединения внахлест при сдвиге: 1379 kPa
Удельный вес: 3.8
Дюрометр: 77
Рабочая температура: -55 to 200 °C
Продолжительность работы: 0.5 hour
Срок хранения: 6 Months
Толщина пленки: 0.25 mm
Customer Value Proposition:

CHO-BOND 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1030 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches (0.25mm)), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches (0.25 mm). No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1030 a good choice for a variety of commercial and military applications. CHOBOND 1030’s moisture cure silicone polymer system allows it to cure to the touch in 24hrs and provides a robust conductive bond over a wide range of application temperatures. For best adhesion results, CHO-BOND 1030 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents and windows.


Features and Benefits:

• One component
• Easy to use, no weighing or mixing required.
• Silver plated copper filler
• Good conductivity 0.050 ohm-cm.
• No VOCs
• Minimal shrinkage.
• Moisture cure silicone
• Flexible, 30 minute working life, rapid skin formation, > 200 psi lap shear strength, 24 hr handling time, wide range of application temperatures. 1 week for full cure.
• Non corrosive cure mechanism
• No corrosive by-products generated during curing to damage substrate.
• Medium paste
• Can be used on overhead or vertical surfaces.