CHO-BOND 1038 ONE COMPONENT ELECTRICALLY CONDUCTIVE SILICONE SEALANT

Артикул

-

Бренд

Parker

Цена

-

Описание

Краткое описание: CHO-BOND 1038 is a silver-plated copper
filled, one-component conductive silicone.
It is designed for use as a fillet, gap filler
and seam sealant on electrical enclosures
for EMI shielding or electrical grounding.
Опции полимерных материалов: Silicone
Материал наполнителя: Silver-plated copper
Коэффициент: 1-part
Цвет: Gray
Объемное сопротивление: 0.01 Ω-cm
Прочность соединения внахлест при сдвиге: 1034 kPa
Удельный вес: 3.6
Дюрометр: 80
Рабочая температура: -55 to 125 °C
Продолжительность работы: 0.5 hour
Срок хранения: 6 Months
Толщина пленки: 0.18-3.18 mm
CHO-BOND 1038 is a silver-plated copper
filled, one-component conductive silicone.
It is designed for use as a fillet, gap filler
and seam sealant on electrical enclosures
for EMI shielding or electrical grounding.
Minimum recommended bond line for CHOBOND
1038 is 0.007 inches (0.18mm). In
addition, CHO-BOND 1038 may be used for
EMI gasket repair, bonding, and attachment
in applications where moderate strength
(less than 150 psi) is required. CHO-BOND
1038’s moisture cure silicone polymer
system allows it to cure to the touch in 24
hours and provides a robust conductive and
environmental seal over a wide range of
application temperatures. For applications
requiring zero volatile organic compounds
(VOCs) or minimal shrinkage, Parker
Chomerics offers a solvent free version of
CHO-BOND 1038 called CHO-BOND 1121.
For best adhesion results, CHO-BOND 1038
should be used in conjunction with CHOSHIELD
1086 primer. Typical applications
include man portable electronics, radar and
communication systems, EMI vents, military
ground vehicles, and shelters.

Features and Benefits:

• One component
• Easy to use, no weighing or mixing required.
• Silver plated copper filler
• Excellent conductivity 0.010 ohm-cm
• Moisture cure silicone • 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
• Non corrosive cure mechanism
• No corrosive by-products generated during curing to damage substrate.
• Medium paste
• Easy to dispense, apply and spread, can be used on overhead or vertical surfaces.
• No VOCs version: CHO-BOND 1121
• Minimal shrinkage, no permits or ventilation required.