THERM-A-FORM CIP35 Thermally Conductive Cure-In-Place Compound

Артикул

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Бренд

Parker

Цена

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Описание

Краткое описание: Parker Chomerics THERM-A-FORM™ CIP35 is two component dispensable thermal compound with 3.5 W/m-K thermal conductivity.

Опции полимерных материалов: Silicone
Материал наполнителя: Aluminum Oxide/Boron Nitride
Удельный вес: 2.87
Дюрометр: 55 (Shore A)
Динамическая вязкость: 5000 (poise)
Теплопроводность: 3.5 W/m-K
Теплоемкость: 1 J/g-K
Коэффициент теплового расширения: 150 ppm/K
Рабочая температура: -67 to 392 °F (-55 to 200 °C)
Диэлектрическая прочность: 10 kVac/mm (250 Vac/mil)
Объемное сопротивление: 1.0 x 10^14
Диэлектрическая проницаемость: 8 @ 1000 kHz
Коэффициент рассеяния: 0.010 @ 1000 kHz
Класс воспламеняемости: UL 94 V-0
Общая потеря массы вследствие выделения газов: 0.22% (0.06% CVCM)
Срок хранения: 12 Months
Максимальное время застывания (при комнатной температуре): 30 min @ 150ºC or 180 min @ 100ºC or 48 hrs @ 23ºC
Parker Chomerics THERM-A-FORM™ CIP35 is two component, dispensable thermal compound, with 3.5 W/m-K thermal conductivity, designed to cool electronics without excessive compressive force in sensitive cooling applications.

This versatile liquid can be hand or robotically dispensed and then cured into complex geometries for cooling of multi-height components on a printed circuit board (PCB) without the expense of a molded sheet.

CIP35 is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.
This product has a thermal conductivity of 3.5 W/m-K and a hardness of 55 Shore A.

Features and Benefits:
• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping
• Long shelf life, no settling or degradation of cure
• Sag resistance. Maintains shape during cure

Typical Applications:
• Automotive Electronic Control Units (ECUs)
Power Supplies & Semiconductors
Memory & Power Modules
Microprocessors / Graphics
Processors
Flat Panel Displays & Consumer Electronics