THERM-A-GAP GEL 30G High Performance Fully Cured Dispensable GELS

Артикул

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Бренд

Parker

Цена

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Описание

Краткое описание: Parker Chomerics THERM-A-GAP GEL 30G fully cured dispensable GELs has 3.5 W/m-K Thermal Conductivity as a one component fully cured system.
Цвет: Pink
Расход: 20 grams/min
Удельный вес: 3.2
Деформация при давлении: 2
Толщина пленки: 0.1 mm
Теплопроводность: 3.5 W/m-K
Теплоемкость: 1 J/g-K
Коэффициент теплового расширения: 150 ppm/K
Рабочая температура: -67 to 392 °F
Диэлектрическая прочность: 200 VAC/mil
Объемное сопротивление: 10^14 Ω-cm
Диэлектрическая проницаемость: 7 @ 100 kHz
Коэффициент рассеяния: 0.002 @ 100 kHz
Соблюдены требования технических условий: UL 94 V-0, RoHS
Общая потеря массы вследствие выделения газов: 0.15 (0.05) %
Срок хранения: 18 Months
Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility.

• Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
• Proven reliability in extreme temperature cycling and shock & vibration
• Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.

Typical Applications

• Automotive Electronic Control Units (ECU’s)
• Power Supplies & Semiconductors
• Memory & Power Modules
• Microprocessors / Graphics Processors
• Flat Panel Displays & Consumer Electronics

Features/Benefits

• Easily dispensable
• Fully-cured / No pump out
• High bulk thermal conductivity
• Low thermal impedance
• Ultra low compression force
• High tack surface & reworkable
• Proven long-term reliability


Typical Applications

• Automotive Electronic Control Units (ECU’s)
• Power Supplies & Semiconductors
• Memory & Power Modules
• Microprocessors / Graphics


Processors

• Flat Panel Displays & Consumer Electronics

Features/Benefits

• Easily dispensable
• Fully-cured / No pump out
• High bulk thermal conductivity
• Low thermal impedance
• Ultra low compression force
• High tack surface & reworkable
• Proven long-term reliability


Product Attributes - GEL 30

• Accommodates a variety of bond line thicknesses for application to multiple devices
• Gel 30 has been successfully used to fill a variety of different gap thickness. Please reference the Gel 30 Reliability test report for additional details and surface recommendations.
• High Bulk Thermal Conductivity
• Excellent performance-to-price
• Compatible with high volume, automated dispense processes
• Meets Telcordia (Bellcore) silicone specifications