THERMFLOW Phase-Change Thermal Interface Pads

Артикул

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Бренд

Parker

Цена

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Описание

Краткое описание: Parker Chomerics THERMFLOW phase-change thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids.

Цвет: Pink, Gray, Gray/Gray foil, Light Gray/Off-White, Purple/Gray foil
Тип рабочего органа: 1 Mil Polyester, 1 Mil Metal Foil, 2 Mil Fiberglass, or Free Film (No Carrier)
Удельный вес: 1.1 to 3.65
Рабочая температура: -67°F to 257°F (-55°C to 125°C)
Тип продукта: Traditional Phase Change, Dual Phase Change
Объемное сопротивление: 10^14 ohm-cm, Non-Conductive
Срок хранения: 12 months
Класс воспламеняемости: Not Tested, UL 94 V-0
Parker Chomerics THERMFLOW® phase-change materials are designed to displace entrapped air between power dissipating electronic components. Phase-change materials maximize heat sink performance and improve component reliability. THERMFLOW pads soften as they reach component operating temperatures. Upon reaching operating temperature, THERMFLOW materials will fully change phase and attain minimum bond-line thickness (MBLT) to maximize surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path.

At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. With light clamping pressure, they will readily conform to both mating surfaces. Standard THERMFLOW products are electrically non-conductive, however metal-to-metal contact is possible after the material undergoes phase-change, decreasing their electrical isolation properties. PC07DM-7 is the only THERMFLOW material recommended for use as a dielectric insulator. Parker Chomerics offers two types of phase change materials—traditional thermal interface pads (PCM) and dual phase change polymer solder hybrids (PSH)

THERMFLOW T557, T558 and T777 are dual phase change polymer solder hybrid (PSH) thermal interface materials. This means that both binder and filler change phases, which helps to exhibit the lowest thermal impedance of the THERMFLOW family. These thermal interface materials provide superior long-term reliability performance. For optimum performance, THERMFLOW must be exposed to temperatures above 64°C during operation or by a burn-in cycle to achieve lowest thermal impedance and highest thermal performance.

Typical Applications

• Microprocessors
• Graphics processors
• Chipsets
• Memory modules
• Power modules
• Power semiconductors

Features and Benefits

• Low thermal impedance
• Proven solution – years of production use in personal computer OEM applications
• Demonstrated reliability through thermal cycling and accelerated age testing
• Can be pre-applied to heat sinks
• Protective release liner prevents contamination of material prior to final component assembly
• Tabs available for easy removal of release liner (T710, T725, T557, T777, PC07DM-7)
• T710 is available with PSA only
• Available in custom die-cut shapes, kiss-cut on rolls